The Thermo Fisher Scientific Semiconductor Capabilities brochure provides process and defect engineers, as well as production managers, with a quick reference to Thermo Fisher Scientific's capability offerings in the fields of plasma mass spectroscopy, FT-IR metrology, Raman microspectroscopy and numerous X-ray spectroscopies including angle-resolved XPS, microbeam XRF and EDS for electron microscopy and defect review.
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Brochure contents include:
Plasma Mass Spectrometry for Contamination Control
ICP Analysis - from Sand to Wafer: Thermo Fisher Scientific offers the full range of ICP-MS instrumentation featuring advanced collision cell or magnetic sector field technology - ideal for a range of applications in semiconductor, from UPW analysis, to analysis of VPD samples and direct analysis of inorganic or organic chemicals.
The perfect match for every task in the semiconductor laboratory Thermo Fisher Scientific's ICP instrumentation guarantees short turnaround times to ensure prompt production support.
Thermo Fisher Scientific's Plasma Mass Spectrometer Products:
• ELEMENT2 ICP-MS
• XSeriesII Quadrupole ICP-MS
• ELEMENT GD High Resolution Glow Discharge-MS
FT-IR Metrology Tools for Wafer Analysis
Used for both research and routine analysis, FT-IR is an ideal, non-destructive technique for the measurement and characterization of silicon wafers. Most commonly used high-resistivity epitaxial layers are transparent to infrared radiation, making FT-IR a preferred method for epitaxial layer film thickness measurements.
Thermo Fisher Scientific's FT-IR Metrology products:
•Nicolet ECO 3000 FT-IR Metrology Tool
•Nicolet ECO/RS Wafer Profiling System
ARXPS Ultra-thin Film Metrology Tool for 300 mm Wafers
The Theta 300XT manages the transition of new gate dielectrics and other thin structures from development to production. Patented Theta technology allows data from every
angle to be collected in parallel in a single measurement.
This allows Theta 300XT to provide non-destructive depth profiles throughout an ultra-thin film stack. Typical applications include: high-k, low-k, barrier/seed, shallow implants, partial coverage, STI passivation, metal gate, self assembled monolayer and strained Si.
•Theta 300 High Performance ARXPS Spectrometer
Microbeam XRF Thin Film Metrology Systems
The MicroXR microbeam XRF tool uses a unique combination of collimated X-ray technology and traditional energy dispersive X-ray fluorescence (EDXRF) to create a non-contact, nondestructive metrology technique - microbeam XRF - ideally suited for the measurement of metal film layers.
•MicroXR Microbeam XRF System
X-ray Microanalysis for SEM/EDS
The NORAN System 7 X-ray microanalysis system provides a complete X-ray analyzer system for your electron microscope. Designed for Spectral Imaging data collection and analysis, the NORAN System 7 includes the most accurate automatic element ID software for defect review tools and general spectral analysis. Thermo Fisher Scientific offers the highest resolution X-ray detectors in the industry, and includes several no-LN models for cleanroom operation.
•NORAN System 7 X-ray Microanalysis System
Raman Microspectroscopy
Useful for routine analysis in production environments, or for defect/failure analysis, Raman spectroscopy requires minimal sample preparation. Raman is particularly adept in the analysis of molecular structure and geometries. Raman can identify many carbon-based compounds (inorganic and organic) that SEM/EDS is unable to analyze, such as photoresists and polymers.
The Nicolet Almega XR dispersive Raman microspectrometer provides a very small excitation laser spot size at the sample. Combining small spot optics with the use of an integral confocal aperture and patented* instrument alignment provides spatial resolution down to 1 micron and depth-profile capabilities in a easy to use walk-up microscope.
•Nicolet Almega XR Dispersive Raman Spectrometer
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