Theta 300XT - 300 mm Wafer Ultra-thin Film Metrology
For the advanced characterization of ultra-thin films, the Theta 300XT offers an assortment of features that simplifies the process. With a comprehensive set of processing tools and a unique, patented design, this fully-automated instrument delivers accurate and repeatable measurements.
Product Detail
Theta 300XT – 300 mm Wafer Ultra-thin Film Metrology
The Theta 300XT is the new high performance spectrometer for XPS and ARXPS from Thermo, a major advance in the characterization of ultra-thin films. The fully automated Theta 300XT manages the transition of new gate dielectrics and other thin structures from development to production.
Automated, accurate and repeatable ‘at-line’ measurement of thickness and composition in ultra thin structures
Complete confidence in the uniformity of your wafers with whole wafer mapping of blanket and product wafers
Achieve non-destructive depth profiles throughout ultra-thin film stack through unique patented parallel angle resolved XPS
Field proven technology ensures confidence in the product and the data generated
Whatever your application; SiON, High-k, Low-k, Barrier/Seed, Shallow implant, Partial coverage, STI passivation, Metal gate, Self assembled monolayer or Strained Si – the Theta 300XT will transfer processes from development to volume production.
Material Handling Theta 300XT features a versatile and fully automated material handling system:
Twin loadports
300 mm FOUP or open cassette
200 mm SMIF or open cassette
200 or 300mm single wafers
Support for OHT and AGV
Small samples
Avantage Theta 300XT’s Avantage data system extracts the maximum amount of information from each measurement and features a comprehensive set of processing tools for characterizing new materials:
Relative depth plots
Multiple layer thickness calculator
Depth profile generator
Mapping and uniformity statistics
Export Intra and Inter-wafer statistics to SPC software or Microsoft excel
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