Microbeam X-ray fluorescence (µXRF) is a revolutionary new approach to film thickness determination. Using a focused x-ray beam energy source, MicronX measures the thickness and composition of up to six layers of deposited metals simultaneously, from angstrom to micron thickness ranges.
Product Detail
The MicroXR platform of thin film measurement systems combine X-ray fluorescence (XRF), a non-contact, non-destructive spectroscopy technique with x-ray collimation to create an instrument ideally suited to the thin film measurement needs of the semiconductor, microelectronics, opto-telecommunications, and data storage industries.
MicroXR measures the thickness and composition of up to six layers of deposite metals simultaneously, from angstrom to micron thickness ranges. It can also determine bulk alloy composition for up to twenty elements.
The MicroXR platform consists of several configurations designed to meet specific application requirements.
Ultimate Tool for Metal Film Measurements
Optical collimation delivers 100 times the countrate and 10 times the precision in 20µm - 100µm thickness range
Solid state detectors provide superior sensitivity for thin (100Å–500Å) depositions, multi-layer metal stacks, and elemental peak overlap applications such as Ni/Cu
Vacuum Conduit™ dramatically improves accuracy and precision for elements between atomic numbers 11 and 20 (such as P, Si, and Al) without requiring sample chamber evacuation
0 Items 
