Semiconductor Devices
Metal Film Stacks, Wafer Bump Metallury, Under Bump Metallurgy

• Sn-Pb/Cu/Si
• Au/Ni-P/Cu/TiW/Si
• Cu/Cr/Ti/Si
• Al(Cu-Si)/Si

Packaging and Interconnects
Leadframes, Chip Carriers, Package Metallurgy, Package-to-Die Connection Metallurgy

• Au/Ni/Cu, KVR
• Sn-Pb/Copper Alloys
• Pd-Ni/Cu
• Au/Ni/Mo-Mg, W
• Au/Pd/Ni/Cu

Rigid and Flexible Circuit Substrates
Epoxy Laminte (FR-4), Ceraminc Circuits (Al203), Flexible Circuits (Polymide)

• Au/Ni/Cu
• Immersion Au/Ni/Cu
• Sn-Pb/Cu

Data Interconnect
Board Level, System Connection, Wire

• Au/Ni/Cu
• Pd-Ni/Ni/Cu
• Sn/Cu

Passive Devices
Capacitors, Resistors

• Sn-Pb/Ni/Ag/Al203
• Sn/Ni/Ag/Al203
• Pd-Ag/Glass

Opto-telecommunications

• Microwave RF
• Optical filters
• MEMS, MEOMS
• Lasers

Data Storage
Hard Disks, Thin Film Magnetic Head (TFMH)

• Ni-P/Al
• Co Alloy/Cr/Ni-P
• Ni-Co-Fe/AlTiC
• Fe-Si-Al/AlTiC